陽明交大-台積電聯合研發中心「2026 Grand Challenges」 計畫申請

Primary Objective:
The primary objective of the NYCU x tsmc 2026 Grand Challenges (inc. multi-year Big League,..) and ARP program is to develop advanced semiconductor materials, processes, integration, devices, packaging, and design technologies that support the future development of energy-efficient cloud and edge AI chips and 3Dx3D superchips.

Pre-Proposal:
The proposal should be submitted by a team of two to three professors. The first stage will be submitted in the form of a pre-proposal for review, in the format as per the attachment. The pre-proposal should outline a plan for addressing Grand Challenges in the AI era within the next three years. The content should include: team members, research topic, research abstract (including linkage to the program’s primary objective), and major innovations. The overlap with existing projects sponsored by tsmc should be avoided. Research topics include, but are not limited to, the following topics:

Device: Novel high-energy efficiency next-generation transistors and underpinning materials, processes, and fundamental mechanism modeling
Memory: Emerging memory device (material, cell array), memory for generative AI
Interconnect: low resistance metal and low k material
Packaging: Novel materials (e.g. for large dimension and multi-layer heterogeneous 3Dx3D superchips, stress/warpage management, .. ), Heat dissipation, advanced substrate and manufacturing, system architecture for AI and high-performance computing

Design: Design technology co-optimization, High-throughput power-efficient machine learning accelerator design, Power delivery and management circuits in SoC, 3D, and heterogeneous integration, Next-gen high-speed high-bandwidth connectivity innovations

Specialty: Sensors and IoT, Si Photonics

Process: Novel materials (topological metal, low dimension, high thermal conductance,..etc ) and advanced process (e.g., selective growth, gap fill ..etc.)

POC (Proof of Concept) test vehicles and feasibility studies in later years of multi-year projects for short-loop or integrated flow demonstration are encouraged.

Timeline and Selection:

Pre-proposals Abstract(up to 2 pages) must be submitted to Ms. Jiang at drj@nycu.edu.tw by January 6, 2026. Invitations to the second-stage Big-League proposal will be determined based on the quality of the pre-proposal and its alignment with the overall Big-League theme. High-quality submissions that do not fit the Big-League framework will be recommended for the TSMC 2027 ARP Program.